View CBA3216GM471N4_4530816.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DPS-081104
CHIP BEADS ARRAY
Array Series
v Features
* Good reliability (Monolithic structure) * Magnetically shielded * Fast mounting speed * RoHS compliant W D L
Size L W 3216 3.20.20 1.60.20 0.90.20 0.30.20 0.40.15 0.80.10
v Dimensions
(unit : mm)
B T E
v Applications
* CD-ROM, DVD, MD Lines * Digital TVs and VTRs
v General Code
CBA
1
T B
3216
2
G
3
A
4
121
5
N4
6
E
7
E D
1
2
3
4
5
6
7
Series Code CBA : Chip Ferrite Beads Array Dimension Code The first two digits : length (mm) The last two digits : width (mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 121 = 120 () Number of circuit N4 : 4 array Packaging Code E : Reel embossed tape packaging
v Temperature Range
* Operating Temp. -55 ~ +125 * Storage Temp. -10 ~ +40
v Typical Material Characteristics
High
(Low RXCP)
Low
(High RXCP)
V M J,K A
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
v 3216 SIZE
Impedance () 25% 30 60 120 220 300 470 601 100 60 120 220 300 470 600 1000 30 60 120 300 470 600 DC Resistance () max. 0.10 0.25 0.30 0.35 0.40 0.45 0.50 0.70 0.25 0.30 0.35 0.40 0.50 0.60 0.75 0.10 0.12 0.20 0.45 0.45 0.50 Rated Current (mA) max. 200 200 300 150 100 100 100 50 400 350 250 250 200 200 150 200 200 100 100 100 100 100 Test Frequency (MHz)
Samwha P/N CBA3216GA300N4 CBA3216GA600N4 CBA3216GA121N4 CBA3216GA221N4 CBA3216GA301N4 CBA3216GA471N4 CBA3216GA601N4 CBA3216GA102N4 CBA3216GK600N4 CBA3216GK121N4 CBA3216GK221N4 CBA3216GK301N4 CBA3216GK471N4 CBA3216GK601N4 CBA3216GK102N4 CBA3216GM300N4 CBA3216GM600N4 CBA3216GM121N4 CBA3216GM301N4 CBA3216GM471N4 CBA3216GM601N4 Measuring Equipment
CHIP BEAD ARRAY Series
-. Z : HP4291B / E4991A -. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
v 3216 SIZE
CBA 3216 GA 300 N4
Impedance [W]
60
100
CBA 3216 GA 600 N4
Z R X Impedance [W]
200
CBA 3216 GA 121 N4
Z R X
Impedance [W]
45
75
150
Z
30
50
100
R
15
25
50
X
0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
300
CBA 3216 GA 221 N4
Z Impedance [W] R
400
CBA 3216 GA 301 N4
Z Impedance [W] R
800
CBA 3216 GA 601 N4
Z R
Impedance [W]
225
300
600
CHIP BEAD ARRAY Series
150
200
400
75
X
100
X
200
X
1 10 100 1000
0
1
10
100
1000
0
1
10
100
1000
0
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
1200
CBA 3216 GA 102 N4
Z Impedance [W] R
240
CBA 3216 GK 121 N4
Z R Impedance [W]
400
CBA 3216 GK 221 N4
Z R X
1 10 100 1000
Impedance [W]
900
180
300
600
120
200
300
X
60
X
1 10 100 1000
100
0
1
10
100
1000
0
0
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
600
CBA 3216 GK 301 N4
Impedance [W]
800
CBA 3216 GK 471 N4
Z R Impedance [W]
1000
CBA 3216 GK 601 N4
Z
Impedance [W]
400
Z R
600
750
R
500
400
200
200
250
X
X
0 1 10 100 1000 0 1 10 100
X
1000 0 1 10 100 1000
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
Reliability & Test Condition
Item
Operating temperature range Storage temperature range
Requirements
- 55 ~ + 125 40 max., 70% RH max.
Test Conditions
at packing condition Preheat temperature : 100 ~ 150 Preheat time : 60 sec. Solder temperature : 245 5 Soldering time : 10 1 sec.
Solderability
More than 90% of the terminal electrode shall be covered with new solder
CHIP BEAD, Reliability & Test Condition
Resistance to soldering heat
1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 30 % More than 50% of the terminal electrode shall be covered with new solder
Preheat temperature : 100 ~ 150 Preheat time : 60 sec. Solder temperature : 270 10 Soldering time : 10 0.5 sec.
Reflow soldering
ST ST
1 CT 3 CT
Preheat temperature : 150 Preheat time : 60 sec. Solder temperature : 245 5 Soldering time : 10 sec. max. (Reflow soldering profile)
High temperature resistance
Temperature : 125 3 Time : 500 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 125 3 Applied current : rated current Time : 1000 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 40 2 Humidity : 90 2 % RH Time : 500 12 hours Measurement at room ambient temperature after placing for 24 hours
High temperature load resistance
1. No mechanical damage 2. Impedance shall not change more than 30 %
Humidity resistance
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
Reliability & Test Condition
Item Requirements Test Conditions
Temperature : 40 2 Humidity : 90 2 % RH Applied current : rated current Time : 500 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : -55 3 Time : 1000 12 hours Measurement at room ambient temperature after placing for 24 hours 1. -55 3 for 30 minutes 2.125 3 for 30 minutes 3. repeat 100 cycle Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Drop 10 times on a concrete floor from a height of 100 cm No mechanical damage ITEM Flexure strength A (mm) B (mm) C (mm) W (kgf)
4 ARRAY
Humidity load resistance
Low temperature resistance 1. No mechanical damage 2. Impedance shall not change more than 30 % Thermal shock
CHIP BEAD, Reliability & Test Condition
Vibration
Drop
R0.5
Land pattern BC A D
0.8 0.8 3.0 0.4
W
50
20
W
Bending strength The terminal electrode shall be neither break off nor the chip damage
R340
2 mm Resistance meter
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Standard Quantity
Size 1005 1608 2012 3216 4516 4532 Q'TY(PCS) 10,000 4,000 4,000 3,000 2,000 1,000 0.85 T size Remarks
v Reel Dimension
CHIP BEAD, Packaging
(Unit:mm)
A 1782 D 40.8 B 50 min. E 20.2 C 130.5 W 91.5
v Leader & Blank Portion
(Unit:mm)
Blank 35050 mm 60 Pitch Chips Blank 35050 mm 60 Pitch Leader 150 min
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Taping Dimensions (Paper tape)
T
A
B
S
P
(Unit:mm)
Type 1005 1608 2012
A 0.1 1.15 1.80 2.30
B 0.1 0.65 1.00 1.55
P 0.1 2.0 4.0 4.0
S 0.1 1.0 2.0 2.0
T (Max.) 0.8 1.1 1.1
CHIP BEAD, Packaging
v Taping Dimensions (Emboss tape)
(Unit:mm) Type 2012 3216 4516 4532 A 0.1 2.25 3.50 4.90 4.85 B 0.1 1.45 1.85 1.90 3.60 C 0.1 1.50 1.25 1.35 1.40 D 0.1 0.23 0.23 0.30 0.30
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Soldering Profile
v Reflow Soldering
Pre - heating 230 180 150
Soldering 2455
Cooling
10 sec. max.
60~120 sec.
30~60 sec.
60 sec. min.
CHIP BEAD, Soldering Profile
v Flow Soldering
Pre - heating 250 180 150
Soldering 2505
Cooling
60 sec. min.
10 sec. max.
60 sec. min.
v Manual Soldering
300 Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. 2 sec. max.
Tc
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD

▲Up To Search▲

Price & Availability of CBA3216GM471N4

	To Download CBA3216GM471N4 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .